Joint workshop of 5th Workshop on Quantum and Classical Cryogenic Devices, Circuits, and Systems, 16th Superconducting SFQ VLSI Workshop, and 2nd International Workshop of Spin/Quantum Materials and Devices (November 16–17, 2023 | Sendai, Japan)

Welcome

The Joint Workshop of 5th Workshop on Quantum and Classical Cryogenic Devices, Circuits, and Systems (QCCC 2023), 16th Superconducting SFQ VLSI Workshop (SSV 2023), and 2nd International Workshop of Spin/Quantum Materials and Devices (IWSQMD 2023) will be held on from November 16th to 17th, 2023. The conference venue is Advanced Institute for Materials Research (AIMR), Tohoku University, Sendai, Japan. See the "Venue" page for detail.

News

Scope & Aims

The workshop aims at providing an opportunity to discuss key aspects of SFQ VLSI technologies, cryogenic quantum/classical devices, circuits, and systems. This year the workshop is co-hosted with IWSQMD2023 focusing on the various topics of spintronics and quantum materials/devices. Latest results related to novel materials, device fabrication, circuit design, function testing, system integration, and their applications will be exchanged.

Sponsors

This workshop is sponsored by the following organizations and national projects in Japan.

Call For Papers

Presentations

Contributed papers will be presented in either oral or poster sessions. All presentations must be in English.

Invited Speakers

Distinguished researchers will be invited to SSV 2023.
(The list is in alphabetical order.)

Registration

Those who will participate in the workshop with or without submitting a paper need to register in advance. The deadline for workshop registration is Wednesday, October 25th 5:00 p.m., 2023.

Please follow the instructions in the Registration page.

Submission of manuscript for proceedings

All manuscripts for proceedings must be submitted using the SSV 2023 Online Submission & Registration site. The deadline for the submission of camera-ready manuscripts is Wednesday, October 25th 5:00 p.m., 2023.

Please follow the instructions in the Proceeding page.